A volume taken from papers presented at the Workshop on Stress Induced Phenomena in Metallization. This conference has been extended to reflect interest in interconnect metallization. First, the topics in metallization were extended to include problems related to atomic transport for reflow and filling of vias and contact holes, silicadation, and barrier metals. These topics are of particular interest for the development of the quarter-micron metallization. Metallization for liquid crystal display of devices and surface acoustic devices is also included. Problems relating to mass transport in these devices have become important, and several papers discuss the similarities and differences of these phenomena and their mechanisms.