In this book, Quirk and Serda introduce the terminology, concepts, processes, products, and equipment commonly used in the manufacture of ultra large scale integrated (ULSI) semiconductors. The book provides helpful, up-to-date technical information about semiconductor manufacturing and strikes an effective balance between the process and equipment technology found in wafer fabrications. Topics include copper interconnect; dual damascene additive process for metallization; deep UV sub-micron photolithography (.18 micron and below); low-k dielectric processing; chemical mechanical planarization; a comprehensive model of manufacturing process; chemical-mechanical polish (CMP); and maintenance and troubleshooting. For practicing semiconductor manufacturing technicians or those interested in semiconductor manufacturing technology and processes.