Papers from a September 2006 conference, 86 in all, cover all aspects of the use of ultra-clean technology for large-scale integration of semiconductors, and cleaning and contamination-control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing. Papers are in sections on SiO2 removal and drying, surface chemistry of Si and Ge, FEOL selective wet etching and corrosion, FEOL photo-resist removal and substrate loss, particle removal and damage, contamination control, metrology, post-CMP cleaning, and BEOL and contact cleaning. Specific topics examined include surface preparation challenges on nitride gate oxides, all-wet stripping of FEOL photoresist using mixtures of sulphuric acid, effects of dopants on the dissolution behavior of silicon substrates in HF-based cleaning solutions, and modeling of shock wave emission during acoustically-driven cavitation-induced cleaning processes. The book is distributed in the US by Trans Tech Publications. Annotation ©2008 Book News, Inc., Portland, OR (booknews.com)