TPC812 High Performance Vapor Chamber Cooler Compatible with Intel LGA 2011/1366/1156/1155/775, AMD FM1/AM3+/AM3/AM2+/AM2. The TPC 812 uses 2 separate cooling technologies to transfer heat. heat pipes and vertical vapor chambers, Ready for overclocking, benchmarking and silent cooling. The first-ever CPU heatsink to use vertical vapor chamber technology. 100% pure polished copper base. combined with improved soldering technologies for the best thermal transfer. Special fin design. heatsink receives concentrated cold airflow. Improved air pressure design and fan mounting system.