SpecificationsPremium ceramic thermal compoundNot for use with thermal pads or phase-change thermal materialMade with micronized aluminum oxide and boron nitride.Controlled triple phase viscosity.Absolute Stability; Arctic Alumina will not separate, run, migrate, or bleed.Electrical Insulator.Thermal conductivity: >4.0 W/mK (Hot Wire Method Per MIL-C-47113)Thermal Resistance: Extended temperature limits: û 40?C to >180?C 2 to 10 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads.