SpecificationsMfr Part Number: AS5-12GFeatures: Contains 99.9% pure silverHigh-Density(contains over 88% thermally conductive filler by weight)Controlled Tripple-Phase ViscosityNot Electrically Conductive and Absolute Stability (will not separate, run, migrate, or bleed) Thermal Conductance: >300,000W/m2 °C (0.001 inch layer)Thermal Resistance: Average Particle Size: Extended Temperature Limits: Peak: -50°C to >180°C Long-Term: -50°C to 130°CPerformance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core